- Employer
- Intel
- Infrastructure segment
- Semiconductor fabs
- Location
- Hillsboro, OR
- Build phase
- infrastructure
- Discipline
- infrastructure
- Published compensation
- Annual Salary Range for jobs which could be performed in the US: $76,390.00-146,440.00 USD
ROLE OVERVIEW CURRENT LISTING
What the employer is hiring for.
We are seeking an Oregon Advanced Packaging Module Engineer to join our advanced manufacturing operations in Hillsboro, Oregon. In this role, you will play a critical part in driving Intel’s advanced semiconductor manufacturing processes.
Review the complete employer listing for current requirements, compensation, benefits, and availability.