CURRENT ROLE Semiconductor fabs / infrastructure

Module Engineering - Day Shift 5 or 7

EMPLOYER LISTING Intel careers Source updated 12 days ago Application and current terms remain with the employer.
63-day coverage window Coverage
Employer
Intel
Infrastructure segment
Semiconductor fabs
Location
Phoenix, AZ
Build phase
infrastructure
Discipline
infrastructure
Published compensation
Annual Salary Range for jobs which could be performed in the US: $99,030.00-139,810.00 USD

ROLE OVERVIEW CURRENT LISTING

What the employer is hiring for.

We are seeking a Foundry Packaging Module Engineer to join our operations in Chandler, Arizona. In this role, you will develop and optimize assembly processes and equipment, applying innovative concepts to enable Intel's next-generation foundry packaging platform technologies.

Review the complete employer listing for current requirements, compensation, benefits, and availability.

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