CURRENT ROLE Semiconductor fabs / infrastructure

NM Wafer Packaging Manufacturing: Advanced Packaging Module Engineer

EMPLOYER LISTING Intel careers Source updated yesterday Application and current terms remain with the employer.
65-day coverage window Coverage
Employer
Intel
Infrastructure segment
Semiconductor fabs
Build phase
infrastructure
Discipline
infrastructure
Published compensation
Annual Salary Range for jobs which could be performed in the US: $76,390.00-146,440.00 USD

ROLE OVERVIEW CURRENT LISTING

What the employer is hiring for.

we are seeking Module Engineers specializing in Wafer-Level Assembly, Die Preparation, and Metrology. These roles will support both high-volume manufacturing (HVM) and technology development activities, including process transfers and product start-ups for Foveros, Embedded Bridge, and Intel Foundry Services (IFS) technologies.

Review the complete employer listing for current requirements, compensation, benefits, and availability.

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