- Employer
- Intel
- Infrastructure segment
- Semiconductor fabs
- Location
- Phoenix, AZ
- Build phase
- infrastructure
- Discipline
- infrastructure
- Published compensation
- Annual Salary Range for jobs which could be performed in the US: $51,710.00-99,770.00 USD
ROLE OVERVIEW CURRENT LISTING
What the employer is hiring for.
We are seeking a detail-oriented and collaborative Packaging Module Engineering Technician to support advanced packaging technology development in Arizona. Operating in a state-of-the-art laboratory environment, this fully on-site role focuses on preparing samples, running analytical testing, and evaluating materials.
Review the complete employer listing for current requirements, compensation, benefits, and availability.