- Employer
- Intel
- Infrastructure segment
- Semiconductor fabs
- Location
- Phoenix, AZ
- Build phase
- infrastructure
- Discipline
- infrastructure
- Published compensation
- Annual Salary Range for jobs which could be performed in the US: $155,520.00-298,440.00 USD
ROLE OVERVIEW CURRENT LISTING
What the employer is hiring for.
We are seeking a visionary and action-oriented Packaging Module Development Manager to lead our engineering team in Arizona. In this critical leadership role, you will guide a specialized team responsible for advancing semiconductor packaging processes and introducing new equipment within a 24x7 manufacturing environment.
Review the complete employer listing for current requirements, compensation, benefits, and availability.