- Employer
- Wolfspeed
- Infrastructure segment
- Semiconductor fabs
- Location
- Marcy, New York
- Build phase
- infrastructure
- Discipline
- infrastructure
- Published compensation
- Compensation Range: $81,000.00 - $111,000.00
ROLE OVERVIEW CURRENT LISTING
What the employer is hiring for.
this role you will join the Bond & Grind Engineering team at our Mohawk Valley Fab (MVF) — the world's largest 200mm SiC wafer fabrication facility — to sustain, optimize, and improve temporary bonding and wafer thinning systems used in the manufacture of silicon carbide power devices. The Day-to-Day: Conduct preventive maintenance (MTBPM), tool fingerprinting, and CIPs to meet tool availability goals; troubleshoot chemical delivery sub-systems and drive root cause analysis (RCA) on equipment excursions to prevent recurrence Create and maintain PM procedures, tool configuration records, and tool acceptance specifications; support…
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